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HomeHome & OfficeTools & Home ImprovementPower & Hand ToolsHand ToolsScrewdrivers & Nut DriversScrewdriver Sets4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
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4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
UGX 34,115
UGX 55,12138%
In stock
+ shipping from UGX 9,700 to Central Business District
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Shipped from abroad
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Pickup Station
Delivery Fees UGX 9,700
Ready for pickup between 15 May & 20 May when you order within next 5hrs 58mins
Door Delivery
Delivery Fees UGX 11,700
Ready for delivery between 15 May & 20 May when you order within next 5hrs 58mins
Return Policy
Free return within 7 days for eligible items.Details
Seller Information
sanyashibobocai
50%Seller Score
2 Followers
Seller Performance
Order Fulfillment Rate: Excellent
Quality Score: Very Poor
Product details
100% brand new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel
Package Contents:
4 x BGA Reballing Stencils
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel
Package Contents:
4 x BGA Reballing Stencils
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
Specifications
Key Features
BGA Stencil
Specifications
- SKU: GE779IP2VHRXCNAFAMZ
- Weight (kg): 0.07
Customer Feedback
This product has no ratings yet.
/product/73/8297921/1.jpg?2207)
4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
UGX 34,115
UGX 55,12138%
Questions about this product?