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HomePhones & TabletsMobile Phone AccessoriesAccessory Combo PacksHigh Quanlity Ic Bga Reballing Solder Template Stencil Chipset For Samsung Exynos9810 /8895/7880/7580//7570/3470/3475/cpu
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Shipped from abroad
High Quanlity Ic Bga Reballing Solder Template Stencil Chipset For Samsung Exynos9810 /8895/7880/7580//7570/3470/3475/cpu
UGX 88,638
UGX 150,69341%
In stock
+ shipping from UGX 16,968 to Central Business District
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Delivery & Returns
Shipped from abroad
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Pickup Station
Delivery Fees UGX 16,968
Ready for pickup between 09 July & 13 July when you order within next 14hrs 25mins
Door Delivery
Delivery Fees UGX 18,068
Ready for delivery between 09 July & 13 July when you order within next 14hrs 25mins
Return Policy
Free return within 7 days for eligible items.Details
Seller Information
Ijvha Wsu
60%Seller Score
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Product details
- Origin:Cn(origin)
- Certification:Ce
Specifications
Key Features
- Origin:Cn(origin)
- Certification:Ce
What’s in the box
1*Mobile phone circuit accessories
Specifications
- SKU: GE779EA22IUY8NAFAMZ
- Model: sjpeijian-98451
- Production Country: China
- Size (L x W x H cm): N/A
- Weight (kg): 0.6
- Color: Not Specified
- Main Material: plastic material
- From the Manufacturer: Prohibit high temperature exposure
- Shop Type: Jumia Mall
- Warranty Address: N/A
- Warranty Type: Repair by Vendor
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/product/25/1715041/1.jpg?0251)
High Quanlity Ic Bga Reballing Solder Template Stencil Chipset For Samsung Exynos9810 /8895/7880/7580//7570/3470/3475/cpu
UGX 88,638
UGX 150,69341%
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