Home Home & Office Office Products Office & School Supplies Binders & Binding Systems Multifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

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Multifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

UGX 15,323

UGX 30,64650%

1 units left

+ shipping from UGX 4,505 to Central Business District

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Pickup Station

Delivery Fees UGX 4,505

Ready for pickup between 20 May & 24 May when you order within next 10hrs 41mins

Door Delivery

Delivery Fees UGX 6,505

Ready for delivery between 20 May & 24 May when you order within next 10hrs 41mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

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Seller Performance

Order Fulfillment Rate: Excellent

Quality Score: Excellent

Customer Rating: Excellent

Product details

Model Number: CPU BGA Reballing Stencil
Applicaiton:for Android Phone Repair
Thickness:0.12MM

Material:steel
colour:silver

Package Contents:
1 * BGA Stencil

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

Specifications

Key Features

Stencil

Specifications

SKU: GE779SN0LRCAENAFAMZ
Weight (kg): 0.02

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